View ACPM-7822-TR1_8506291.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

acpm-7822 jcdma 4x4 power amplifer module (898-925mhz) data sheet description thefacpm-7822fisfaffullyfmatchedf10-pinfsurfacefmountf modulef developedf forf jcdma.f thisf powerf ampliferf modulef operatesf inf thef 898-925mhzf bandwidth.f thef acpm-7822fmeetsfstringentfcdmaflinearityfrequirementsf upftof28dbmfoutputfpower.fthef4mmx4mmfformffactorf packagefisfselffcontained,fincorporatingf50ohmfinputfandf outputfmatchingfnetworks thefacpm-7822ffeaturesf5 th fgenerationfoffcoolpamfcircuitf technologyfwhichfsupportsf3fpowerfmodesfCfbypass,fmidf andfhighfpowerfmodes.fthefcoolpamfisfstagefbypassftech - nologyf enhancingf paef (powerf addedf efciency)f atf lowf andfmediumfpowerfrange.factivefbypassffeaturefisfaddedf tof 5thf generationf tof enhancef paef furtherf atf lowf outputf range.fthisfhelpsftofextendftalkftime. thef powerf ampliferf isf manufacturedf onf anf advancedf ingapf hbtf (hetero-junctionf bipolarf transistor)f mmicf (microwavef monolithicf integratedf circuit)f technologyf oferingf state-of-the-artf reliability,f temperaturef stabilityf andfruggedness. features ? f thinfpackagef(0.9mmftyp) ? f excellentflinearityf ? f 3-modefpowerfcontrolfwithfvbpfandfvmodef f bypassf/fmidfpowerfmodef/fhighfpowerfmode ? f highfefciencyfatfmaxfoutputfpower ? f 10-pinfsurfacefmountingfpackage ? f internalf50ohmfmatchingfnetworksfforfbothfrffinputf andfoutput ? f lead-free,frohsfcompliant,fgreen applications ? f digitalfjapanfcdmafbandf(3gpp2fbandfclassf3) ordering information part number number of devices container ACPM-7822-TR1 1000 178mmf(7)ftape/reel acpm-7822-blk 100 bulk component image
2 absolute maximum ratings nofdamagefassumingfonlyfonefparameterfisfsetfatflimitfatfaftimefwithfallfotherfparametersfsetfatforfbelowfnominalf value. operationfoffanyfsinglefparameterfoutsidefthesefconditionsfwithfthefremainingfparametersfsetfatforfbelowfnominalf valuesfmayfresultfinfpermanentfdamage. description min. typ. max. unit rffinputfpowerf(pin) 0 10.0 dbm dcfsupplyfvoltagef(vcc1,fvcc2) 0 3.4 5.0 v enablefvoltagef(ven) 0 2.6 3.3 v modefcontrolfvoltagef(vmode) 0 2.6 3.3 v bypassfcontrolf(vbp) 0 2.6 3.3 v storageftemperaturef(tstg) -55 25 +125 c recommended operating condition description min. typ. max. unit dcfsupplyfvoltagef(vcc1,fvcc2) 3.2 3.4 4.2 v enablefvoltagef(ven) low high 0 1.35 0 2.6 0.5 2.9 v v modefcontrolfvoltagef(vmode) low high 0 1.35 0 2.6 0.5 2.9 v v bypassfcontrolfvoltagef(vbp) low high 0 1.35 0 2.6 0.5 2.9 v v operatingffrequencyf(fo) 898 925f mhz ambientftemperaturef(ta) -30 25 85 c operating logic table power mode ven vbp vmode pout highfpowerfmode high high low ~f28fdbm midfpowerfmode high high high ~f18fdbm bypassfmode high low x ~f11fdbm shutfdownfmode low low low C
3 electrical characteristics conditions:fvcc=3.4v,fven=2.6v,ft=25c,fzin/zout=50ohm,f is-95 rl, unless otherwise specifed . characteristics condition min. typ. max. unit operatingffrequencyfrange 898 C 925 mhz gain highfpowerfmode,fpout=28dbm 23 28 db midfpowerfmode,fpout=18dbm 13 19 db bypassfmode,fpout=11dbm 8 11.5 db powerfaddedfefciency highfpowerfmode,fpout=28dbm 35.3 37.7 % midfpowerfmode,fpout=18dbm 15.3 22.3 % bypassfmode,fpout=11dbm 8.0 11.9 % totalfsupplyfcurrent highfpowerfmode,fpout=28dbm 492 525 ma midfpowerfmode,fpout=18dbm 82 120 ma bypassfmode,fpout=11dbm 29 43 ma quiescentfcurrent highfpowerfmode 93 120 ma midfpowerfmode 23 30 ma bypassfmode 3 5 ma enablefcurrent 100 p a modefcontrolfcurrent 100 p a bypassfcontrolfcurrent 100 p a totalfcurrentfinfpower-downfmode ven=0v,fvmode=0v,fvbp=0v 0.2 5 p a adjacentfchannelf powerfratio 900fkhzfofset 1.98fmhzfofset highfpowerfmode,fpout=28dbm -50 -57 -45 -53 dbc dbc f900fkhzfofset 1.98fmhzfofset midfpowerfmode,fpout=18dbm -51 -64 -46 -54 dbc dbc f900fkhzfofset 1.98fmhzfofset bypassfmode,fpout=11dbm -59 -69 -46 -54 dbc dbc harmonicfsuppression second third highfpowerfmode,fpout=28dbm -30 -40 dbc dbc inputfvswr highfpowerfmode 2:1 2.5:1 stabilityf(spuriousfoutput) in-bandfloadfvswrf<=f5:1,fallfphase forwardedfpowerffixed, allfpowerfmodes,fwithfinputffilter -60 dbc noisefpowerfinfrxfbandf(843-870fmhz) highfpowerfmode,fpout=28dbm -135 -132 dbm/hz noisefpowerfinfgpsfbandf(1575.42fmhz) highfpowerfmode,fpout=28dbm -145 -141 dbm/hz ruggedness nofdamage pout<28dbmf&fpin<10dbm,f f allfphase highfpowerfmode 10:1 vswr
4 characteristics data (vcc=3.4v,fven=2.6,fvbp,fvmode=f0vforf2.6v,ft=25c,fzin/zout=50ohm,fis-95frl) total current vs. output power gain vs. output power adjacent channel power ratio 1 vs. output power adjacent channel power ratio 2 vs. output power power added efciency vs. output power 0 5 10 15 20 25 30 pout (dbm) 0 100 200 300 400 500 0 5 10 15 20 25 30 pout (dbm) current (ma) 8 9 8 m h z 9 1 5 m h z 9 2 5 m h z 5 10 15 20 25 30 gain (db) -70 -65 -60 -55 -50 -45 -40 -35 0 5 10 15 20 25 30 pout (dbm) acpr1 (dbc) -80 -75 -70 -65 -60 -55 -50 0 5 10 15 20 25 30 pout (dbm) acpr2 (dbc) 0 5 10 15 20 25 30 35 40 0 5 10 15 20 25 30 pout (dbm) pae (%) 8 9 8 m h z 9 1 5 m h z 9 2 5 m h z 8 9 8 m h z 9 1 5 m h z 9 2 5 m h z 8 9 8 m h z 9 1 5 m h z 9 2 5 m h z 8 9 8 m h z 9 1 5 m h z 9 2 5 m h z
5 footprint allfdimensionsfarefinfmillimeter x-r a y top v ie w 1 . 9 0 1 . 7 0 0 . 8 5 1 . 2 0 1 . 9 0 0 . 4 0 0 . 4 0 pin description pin # name description 1 ven pafenable 2 vmode modefcontrol 3 vbp bypassfcontrolf 4 rfin rffinput 5 vcc1 dcfsupplyfvoltage 6 vcc2 dcfsupplyfvoltage 7 gnd ground 8 rfout rffoutput 9 gnd ground 10 gnd ground package dimensions allfdimensionsfarefinfmillimeter 4 0 . 1 2 3 4 4 0 . 1 p i n 1 m a rk 1 0.6 0 . 9 0 . 1 5 9 8 7 10 6 marking specifcation pi n 1 ma rk avago acpm-7822 pyyww aaaaa ma n u f a ct u r i n g pa rt n u mb e r l o t n u mb e r p manufacturing info yy manufacturing year w w work week aaaaa assembly lot number
6 metallization solder mask opening solder paste stencil aperture 0 . 2 5 0 . 8 5 0 . 4 0 . 6 0 . 5 0 . 1 ? 0.3mm o n 0 . 6 m m p i t ch 0 . 7 0 . 5 0 . 5 5 0 . 8 5 2 . 4 1 . 8 0 . 6 0 . 5 1 . 6 2 . 0 0 . 8 5 0 . 4 pcb design guidelines thef recommendedf pcbf landf patternf isf shownf inf fguresf onfthefleftfside.fthefsubstratefisfcoatedfwithfsolderfmaskf betweenf thef i/of andf conductivef paddlef tof protectf thef goldf padsf fromf shortf circuitf thatf isf causedf byf solderf bleeding/bridging.f stencil design guidelines af properlyf designedf solderf screenf orf stencilf isf requiredf tofensurefoptimumfamountfoffsolderfpastefisfdepositedf ontofthefpcbfpads.f thefrecommendedfstencilflayoutfisfshownfhere.freducingf thefstencilfopeningfcanfpotentiallyfgeneratefmorefvoids.f onfthefotherfhand,fstencilfopeningsflargerfthanf100%fwillf leadf tof excessivef solderf pastef smearf orf bridgingf acrossf thefi/ofpadsforfconductivefpaddleftofadjacentfi/ofpads.f consideringf thef factf thatf solderf pastef thicknessf willf directlyfafectfthefqualityfoffthefsolderfjoint,fafgoodfchoicef isftofuseflaserfcutfstencilfcomposedfoff0.100mm(4mils)forf 0.127mm(5mils)f thickf stainlessf steelf whichf isf capablef off producingfthefrequiredffnefstencilfoutline.
7 evaluation board schematic 1 ven 2 vmode 3 vbp 4 rfin gnd 10 rfout 8 gnd 7 rfin vmode vcc2 rfout c2 100pf gnd 9 5 vcc1 vcc2 6 vbp c3 100pf vcc1 c4 680pf c5 2.2uf ven c1 100pf c7 2.2uf c6 680pf evaluation board description
8 a c p m-7822 pyyw w aaa a a tape and reel information dimension list dimension millimeter a0 4.400.10 b0 4.400.10 k0 1.700.10 d0 1.550.05 d1 1.600.10 p0 4.000.10 p1 8.000.10 dimension millimeter p2 2.000.05 p10 40.000.20 e 1.750.10 f 5.500.05 w 12.000.30 t 0.300.05
9 plasticfreelfformatf(allfdimensionsfarefinfmillimeters) reel drawing notes: 1.freelfshallfbeflabeledfwithftheffollowingf ffffinformationf(asfafminimum). a.fmanufacturersfnameforfsymbolf b.favagoftechnologiesfpartfnumber c.fpurchaseforderfnumberf d.fdatefcodef e.fquantityfoffunits 2.fafcertifcatefoffcompliancef(cfoffc)fshallf ffffbefissuedffandfaccompanyfeachfshipment ffffoffproduct. 3.freelfmustfnotfbefmadefwithforfcontainff ffffozonefdepletingfmaterials. 4.fallfdimensionsfinfmillimetersf(mm) 50 min. 12.4 +2.0 -0.0 18.4 max. 25 min wide (ref) slot for carrier tape insertion for attachment to reel hub (2 places 180 apart) back view front view 178 shading indicates thru slots +0.4 -0.2 21.0 0.8 13.0 0.2 1.5 min.
10 handling and storage esd (electrostatic discharge) electrostaticf dischargef occurs f naturallyf inf thef environ- f naturallyf inf thef environ- naturallyf inf thef environ - ment. f withfthefincreasefinfvoltage f potential,fthefoutletfoff neutralizationforfdischargefwillfbefsought. f iffthefacquiredf dischargef routef is f throughf af semiconductorf device,f de- f throughf af semiconductorf device,f de- throughf af semiconductorf device, f de- f de- de - structivefdamagefwillfresult. esdfcountermeasurefmethods f shouldfbefdevelopedfandf usedfto f controlfpotentialfesdfdamage f duringfhandlingfinf affactory f environmentfatfeachfmanufacturingfsite. msl (moisture sensitivity level) plasticfencapsulatedfsurfacefmountfpackagefisfsensitiveftof damagefinducedfbyfabsorbedfmoisturefandftemperature. avagoftechnologiesffollowsfjedecfstandardfj-stdf020b.f eachf componentf andf packagef typef isf classifedf forf moisturef sensitivityf byf soakingf af knownf dryf packagef atf variousf temperaturesf andf relativef humidity,f andf times.f moisture classifcation level and floor life msl level floor life (out of bag) at factory ambient =< 30c/60% rh or as stated 1 unlimitedfatf= 11 refow profle recommendations typical smt refow profle for maximum temperature = 260 +0/-5c 25 time temperature tp t l tp t l t 25c to peak ramp-up ts ts min ramp-down preheat critical zone t l to tp ts max typical smt refow profle for maximum temperature = 260 +0/ -5c profle feature sn-pb solder pb-free solder averageframp-upfratef(tlftoftp) 3c/secfmax 3c/secfmax preheat Cfftemperaturefminf(tsmin) Cfftemperaturefmaxf(tsmax) Cfftimef(minftofmax)f(ts) 100c 150c 60-120fsec 150c 200c 60-180fsec tsmaxftoftl fCfframp-upfrate 3c/secfmax timefmaintainedfabove: fCfftemperaturef(tl) fCfftimef(tl) 183c 60-150fsec 217c 60-150fsec peakftemperaturef(tp) 240f+0/-5c 260f+0/-5c timefwithinf5cfoffactualfpeakftemperaturef(tp) 10-30fsec 20-40fsec ramp-downfrate 6c/secfmax 6c/secfmax timef25cftofpeakftemperature 6fminfmax. 8fminfmax.
12 storage condition packagesf describedf inf thisf documentf mustf bef storedf inf sealedf moisturef barrier,f antistaticf bags.f shelff lifef inf af sealedf moisturef barrierf bagf isf 12f monthsf atf <40cf andf 90%frelativefhumidityf(rh)fj-std-033fp.7. out-of-bag time duration afterfunpackingfthefdevicefmustfbefsolderedftofthefpcbf withinf 168f hoursf asf listedf inf thef j-std-020bf p.11f withf factoryfconditionsf<30cfandf60%frh. baking itfisfnotfnecessaryftofre-bakefthefpartfiffbothfconditionsf (storagefconditionsfandfout-offbagfconditions)fhavefbeenf satisfed.fbakingfmustfbefdonefiffatfleastfonefoffthefcon - ditionsfabovefhavefnotfbeenfsatisfed.fthefbakingfcondi - tionsfaref125cfforf12fhoursfj-std-033fp.8. caution tapefandfreelfmaterialsftypicallyfcannotfbefbakedfat f thef temperaturef describedf above. f iff out-of-bagf exposuref timefis f exceeded,fpartsfmustfbefbaked f forfaflongerftimef atf low f temperatures,f orf thef partsf must f bef de-reeled,f de-taped,fre-baked f andfthenfputfbackfonftapefand f reel.f (seef moisturef sensitive f warningf labelf onf eachf shipping f bagfforfinformationfoffbaking). board rework component removal, rework and remount iff af componentf isf tof bef removedf fromf thef board,f itf isf recommendedf thatf localizedf heatingf bef usedf andf thef maximumf bodyf temperaturesf off anyf surfacef mountf componentfonfthefboardfnotfexceedf200c.fthisfmethodf willfminimizefmoisturefrelatedfcomponentfdamage.fiffanyf componentftemperaturefexceedsf200c,fthefboardfmustf befbakedfdryfperf4-2fpriorftofreworkfand/orfcomponentf removal.fcomponentftemperaturesfshallfbefmeasuredfatf theftopfcenterfoffthefpackagefbody.fanyfsmdfpackagesf thatfhavefnotfexceededftheirffoorflifefcanfbefexposedftof afmaximumfbodyftemperaturefasfhighfasftheirfspecifedf maximumfrefowftemperature. removal for failure analysis notffollowingfthefabovefrequirementsfmayfcausefmoisture/ refowf damagef thatf couldf hinderf orf completelyf preventf thefdeterminationfofftheforiginalffailurefmechanism. baking of populated boards somefsmdfpackagesfandfboardfmaterialsfarefnotfableftof withstandflongfdurationfbakesfatf125c.fexamplesfoffthisf arefsomeffr-4fmaterials,fwhichfcannotfwithstandfaf24fhrf bakef atf 125c.f batteriesf andf electrolyticf capacitorsf aref alsof temperaturef sensitive.f withf componentf andf boardf temperaturef restrictionsf inf mind,f choosef af bakef tem - peratureffromftablef4-1finfj-stdf033;fthenfdeterminefthef appropriatef bakef durationf basedf onf thef componentf tof bef removed.f forf additionalf considerationsf seef ipc-7711f andipc-7721. derating due to factory environmental conditions factoryf foorf lifef exposuresf forf smdf packagesf removedf fromfthefdryfbagsfwillfbefaffunctionfoffthefambientfenvi - ronmentalf conditions.f af safe,f yetf conservative,f handlingf approachfisftofexposefthefsmdfpackagesfonlyfupftofthef maximumf timef limitsf forf eachf moisturef sensitivityf levelf asfshownfinfnextftable.fthisfapproach,fhowever,fdoesfnotf workf iff thef factoryf humidityf orf temperaturef isf greaterf thanf thef testingf conditionsf off 30c/60%f rh.f af solutionf forf addressingf thisf problemf isf tof deratef thef exposuref timesf basedf onf thef knowledgef off moisturef difusionf inf thef componentf packagef materialsf ref.f jesd22-a120).f recommendedf equivalentf totalf foorf lifef exposuresf canf befestimatedfforfafrangefoffhumiditiesfandftemperaturesf basedfonfthefnominalfplasticfthicknessfforfeachfdevice. tablefonfnextfpageflistsfequivalentfderatedffoorflivesfforf humiditiesf rangingf fromf 20-90%f rhf forf threef tempera - ture,f20c,f25c,fandf30c. tablef onf nextf pagef isf applicablef tof smdsf moldedf withf novolac,f biphenylf orf multifunctionalf epoxyf moldf compounds.ftheffollowingfassumptionsfwerefusedfinfcal - culatingfthisftable: 1.ff activationf energyf forf difusionf =f 0.35evf (smallestf knownfffvalue). 2.ff forf60%frh,fusefdifusivityf=f0.121expf(f-0.35ev/kt)f mm2/sf(thisfusedfsmallestfknownfdifusivityf@f30c). 3.f forf>60%frh,fusefdifusivityf=f1.320expf(f-0.35ev/kt)f mm2/sf(thisfusedflargestfknownfdifusivityf@f30c).
for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies in the united states and other countries. data subject to change. copyright ? 2005-2009 avago technologies. all rights reserved. av02-1777en - february 17, 2009 recommended equivalent total floor life (days) @ 20c, 25c & 30c for ics with novolac, biphenyl and multifunctional epoxies (refow at same temperature at which the component was classifed) maximum percent relative humidity package type and body thickness moisture sensitiv - ity level 5% 10% 20% 30% 40% 50% 60% 70% 80% 90% bodyfthicknessf3.1fmm includingfpqfpsf>84fpin, plccsf(square) allfmqfps or allfbgasf1fmm levelf2a 60 78 103 41 53 69 33 42 57 28 36 47 10 14 19 7 10 13 6 8 10 30c 25c 20c levelf3 10 13 17 9 11 14 8 10 13 7 9 12 7 9 12 5 7 10 4 6 8 4 5 7 30c 25c 20c levelf4 5 6 8 4 5 7 4 5 7 4 5 7 3 5 7 3 4 6 3 3 5 2 3 4 2 3 4 30c 25c 20c levelf5 4 5 7 3 5 7 3 4 6 2 4 5 2 3 5 2 3 4 2 2 3 1 2 2 1 2 3 30c 25c 20c levelf5a 2 3 5 1 2 4 1 2 3 1 2 3 1 2 3 1 2 2 1 1 2 1 1 2 1 1 2 30c 25c 20c bodyf2.1fmmffthickness <3.1fmmfincluding plccsf(rectangular) 18-32fpin soicsf(widefbody) soicsf20fpins, pqfpsf80fpins levelf2a 86 148 39 51 69 28 37 49 4 6 8 3 4 5 2 3 4 30c 25c 20c levelf3 19 25 32 12 15 19 9 12 15 8 10 13 7 9 12 3 5 7 2 3 5 2 3 4 30c 25c 20c levelf4 7 9 11 5 7 9 4 5 7 4 5 6 3 4 6 3 4 5 2 3 4 2 2 3 1 2 3 30c 25c 20c levelf5 4 5 6 3 4 5 3 3 5 2 3 4 2 3 4 2 3 4 1 2 3 1 1 3 1 1 2 30c 25c 20c levelf5a 2 2 3 1 2 2 1 2 2 1 2 2 1 2 2 1 2 2 1 1 2 0.5 1 2 0.5 1 1 30c 25c 20c bodyfthicknessf<2.1fmm includingfsoicsf<18fpin allftqfps,ftsops or allfbgasf<1fmmfbody thickness levelf2a 28 1 2 2 1 1 2 1 1 1 30c 25c 20c levelf3 11 14 20 7 10 13 1 2 2 1 1 2 1 1 1 30c 25c 20c levelf4 9 12 17 5 7 9 4 5 7 3 4 6 1 2 2 1 1 2 1 1 1 30c 25c 20c levelf5 13 18 26 5 6 8 3 4 6 2 3 5 2 3 4 1 2 2 1 1 2 1 1 1 30c 25c 20c levelf5a 10 13 18 3 5 6 2 3 4 1 2 3 1 2 2 1 2 2 1 1 2 1 1 2 0.5 1 1 30c 25c 20c

▲Up To Search▲

Price & Availability of ACPM-7822-TR1

	To Download ACPM-7822-TR1 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .